Conductive paste and multilayer substrate using same

This conductive paste contains, with respect to (A) 100 parts by mass of a binder component containing 5-60 parts by mass of a solid epoxy resin and 40-95 parts by mass of a liquid epoxy resin in a range not exceeding a total amount of 100 parts by mass: (B) 770-4300 parts by mass of spherical high-...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NISHIMURA, NAOTO, SAKAUE, NAOKI, NAKAZONO, HAJIME, FUJIKAWA, RYOTA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS THEREFOR WOODSTAINS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	This conductive paste contains, with respect to (A) 100 parts by mass of a binder component containing 5-60 parts by mass of a solid epoxy resin and 40-95 parts by mass of a liquid epoxy resin in a range not exceeding a total amount of 100 parts by mass: (B) 770-4300 parts by mass of spherical high-melting-point metal particles having a melting point of at least 800 DEG C; (C) 1510-5400 parts by mass of spherical low-melting-point metal particles having a melting point of at most 240 DEG C; (D) 10-150 parts by mass of a curing agent; and (E) 30-200 parts by mass of a flux.