Wafer expanding apparatus, wafer expanding method and die bonding system characterized by uniformly expanding the dicing tape when expanding the dicing tape, thereby enabling uniform spacing between dies

The present invention provides: a wafer expanding apparatus, a wafer expanding method, and a die bonding system capable of enabling uniform spacing between dies when expanding a wafer. The wafer expanding apparatus includes: a wafer table used to support the wafer ring constituted by a dicing tape attached with a wafer; a supporting ring formed on the wafer table for supporting the dicing tape; a dicing tape expanding device formed on the wafer table, therein at least one portion thereof relatively moves by using the supporting ring as a reference to pressurize the wafer ring for expanding the dicing tape; and an auxiliary pressurization device used to pressurize the lifting portion of the dicing tape expanding device or the wafer ring to uniformly expand the dicing tape when expanding the dicing tape.