Substrate processing method and substrate processing apparatus

Substrate processing method and substrate processing apparatus

A substrate processing method includes: immersing S1 a substrate W in a processing liquid L that is alkaline; and etching S2 with the processing liquid L a polysilicon layer Wc filled in a recess Wb with a columnar shape extending substantially perpendicular to a main surface Wa of the substrate W....

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MATSUNAGA, YASUYUKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A substrate processing method includes: immersing S1 a substrate W in a processing liquid L that is alkaline; and etching S2 with the processing liquid L a polysilicon layer Wc filled in a recess Wb with a columnar shape extending substantially perpendicular to a main surface Wa of the substrate W. In the etching S2, bubbles generated in the recess Wb is removed.