Heat sink

Provided is a heat sink with which it is possible to reduce pressure loss occurring when cooling air flows along a heat-dissipating fin while ensuring exceptional heat exchange performance in the heat-dissipating fin. A heat sink having: a heat-receiving part that is thermally connected to a heat-ge...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAKAI, HIROSHI, HIKICHI, SHUTA, MEGURO, MASAHIRO, KAWABATA, KENYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	Provided is a heat sink with which it is possible to reduce pressure loss occurring when cooling air flows along a heat-dissipating fin while ensuring exceptional heat exchange performance in the heat-dissipating fin. A heat sink having: a heat-receiving part that is thermally connected to a heat-generating body; a flat first heat-dissipating fin that is thermally connected to the heat-receiving part, the first heat-dissipating fin having a first main surface; and a flat second heat-dissipating fin that is thermally connected to the heat-receiving part, the second heat-dissipating fin having a second main surface, and the area of the second main surface being less than the area of the first main surface. The second heat-dissipating fin is disposed between a plurality of the first heat-dissipating fins, specifically at a position such that the second main surface overlaps the first main surface in plan view.