Cleaning composition for adhesives

One embodiment of the present invention provides a cleaning composition that is for adhesives, and that exhibits excellent removability of the adhesives. One embodiment of the present disclosure pertains to a cleaning composition for removing adhesives remaining on wafers. This cleaning composition...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA, KOUHEI, TOTOKI, TAKENORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	One embodiment of the present invention provides a cleaning composition that is for adhesives, and that exhibits excellent removability of the adhesives. One embodiment of the present disclosure pertains to a cleaning composition for removing adhesives remaining on wafers. This cleaning composition for adhesives contains a glycol ether (component A), a hydrocarbon (component B), and an alkanolamine (component C) having a linear alkanol group, and does not contain water or contains water in an amount of 10 mass% or less. The mass ratio A/B between the contained amount of component A and the contained amount of component B is 1.7 or less.