Disassembling device for an integrated circuit component

The present invention is a disassembling device for an integrated circuit component and is configured to disassemble a carrier of the integrated circuit component from an integrated circuit body. The disassembling device for the integrated circuit component includes a base, and a driving mechanism,...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG, TZU-HAN, LIN, HANANG, HONG, CHIHIEH, CHANG, POIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MANIPULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS PRINTED CIRCUITS TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention is a disassembling device for an integrated circuit component and is configured to disassemble a carrier of the integrated circuit component from an integrated circuit body. The disassembling device for the integrated circuit component includes a base, and a driving mechanism, a moving mechanism, a guiding conveying mechanism, a pushing mechanism and a stripping mechanism separately mounted on the base. In the disassembling device for the integrated circuit component of the present invention, the integrated circuit component can be guided by the moving mechanism. With the guiding conveying mechanism guiding and conveying the integrated circuit component, the pushing mechanism is able to push the carrier while the integrated circuit component are being conveyed. The carrier and the integrated circuit body are gradually separated due to flexible bending deformation under the push of the pushing mechanism. With the assistance of the stripping mechanism in stripping, not only can the carrier