Semiconductor device package, semiconductor device package assembly and method of fabricating the same

A power semiconductor device package. The package may include a baseplate that has a plurality of through holes. The package may also include an insulating body, affixed to a top side of the baseplate. The insulating body may include a main portion, to enclose a set of semiconductor devices therein, and a plurality of locking structures, the plurality of locking structures disposed along a lower periphery of the main portion, and integrally formed within the insulating body, wherein the plurality of locking structures extend through the baseplate.