Apparatus for heating wafer

Apparatus for heating wafer

An apparatus for heating a wafer includes a heater, a heating block on an upper surface of the heater, and a plurality of support protrusions protruding from an upper surface of the heating block, wherein the upper surface of the heating block has a curved shape with a concave central portion, and a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PARK, JUN-HYOUN, KIM, JEONG-DU, KIM, SUNG-HYUP, HWANG, JUNG-HWAN, CHOI, GEON-SOO, JIN, DA-HEE
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An apparatus for heating a wafer includes a heater, a heating block on an upper surface of the heater, and a plurality of support protrusions protruding from an upper surface of the heating block, wherein the upper surface of the heating block has a curved shape with a concave central portion, and at least the support protrusion at the central portion of the heating block, among the plurality of support protrusions, is configured to be deformed in response to heating by the heater.