Curable composition, dry film, cured product and electronic component

To provide a curable composition which can achieve good solderability while containing a hydrophilic silica and a silicon-based surface conditioner, and which can solve the problem of agglomeration and precipitation of silica, a dry film, a cured product and an electronic component. A curable compos...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKAGI, KOICHI, TOKAI, HIROYUKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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