Curable composition, dry film, cured product and electronic component

To provide a curable composition which can achieve good solderability while containing a hydrophilic silica and a silicon-based surface conditioner, and which can solve the problem of agglomeration and precipitation of silica, a dry film, a cured product and an electronic component. A curable compos...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAGI, KOICHI, TOKAI, HIROYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a curable composition which can achieve good solderability while containing a hydrophilic silica and a silicon-based surface conditioner, and which can solve the problem of agglomeration and precipitation of silica, a dry film, a cured product and an electronic component. A curable composition comprises (A) an alkali soluble resin, (B) a photoinitiator, (C) an epoxy resin, (D) a silicone compound, (E) a hydrophilic silica, and (F) an organic thixotropic agent. The curable composition can solve the problem of agglomeration and precipitation of hydrophilic silica in a curable composition. On condition that a substrate is coated with the curable composition, (D) the silicone compound keeps the wettability to the substrate, and concurrently, the wettability of flux to a resultant cured product is increased. Therefore, when the cured product is used as a solder resist, the effect of raising the solderability can be achieved.