Flux and solder paste

The flux of the present invention contains a rosin, a solvent, a thixotropic agent, an amine hydroiodide, and an activator (excluding the amine hydroiodide), wherein the amine hydroiodide contains a heteroalicyclic amine hydroiodide. The heteroalicyclic amine hydroiodide is preferably at least one s...

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Bibliographische Detailangaben
Hauptverfasser:	NAGAI, TOMOKO, TAKEMASA, TETSU, HAYAKAWA, MEGUMI, MASAKI, TSUYOSHI, MIYAGI, NANAKO, KANEKO, MUTSUKI, HASHIMOTO, YUTAKA, SAITO, RYO, TAKAGI, KAZUYORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The flux of the present invention contains a rosin, a solvent, a thixotropic agent, an amine hydroiodide, and an activator (excluding the amine hydroiodide), wherein the amine hydroiodide contains a heteroalicyclic amine hydroiodide. The heteroalicyclic amine hydroiodide is preferably at least one selected from the group consisting of piperidine hydroiodide and pipecoline hydroiodide. According to such a flux, it is possible to further suppress the generation of voids during soldering.