Solder alloy, joint part, joining material, solder paste, joint structure, and electronic control device

This solder alloy can provide a joint part having heat cycle resistance and drop impact resistance, the solder alloy containing 45%-63% by mass of Bi, 0.1% by mass or more and less than 0.7% by mass of Sb, 0.05%-1% by mass of In, and the remainder made up of Sn and inevitable impurities, wherein the...

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Bibliographische Detailangaben
Hauptverfasser:	OCHI, GENKI, ARAI, MASAYA, SHIMAZAKI, TAKANORI, MARUYAMA, DAISUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	This solder alloy can provide a joint part having heat cycle resistance and drop impact resistance, the solder alloy containing 45%-63% by mass of Bi, 0.1% by mass or more and less than 0.7% by mass of Sb, 0.05%-1% by mass of In, and the remainder made up of Sn and inevitable impurities, wherein the liquidus temperature is 170 DEG C or less.