Flux and solder paste

The flux of the present invention contains a rosin, a solvent, a thixotropic agent, a thiol compound, and an activator, wherein the thiol compound contains a compound (Tp) having a benzenethiol skeleton in which one or more hydrogen atoms on the benzene ring are substituted with a mercapto group (-S...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NAGAI, TOMOKO, MASAKI, TSUYOSHI, TAKEMASA, TETSU, HAYAKAWA, MEGUMI, MIYAGI, NANAKO, KANEKO, MUTSUKI, HASHIMOTO, YUTAKA, SAITO, RYO, TAKAGI, KAZUYORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The flux of the present invention contains a rosin, a solvent, a thixotropic agent, a thiol compound, and an activator, wherein the thiol compound contains a compound (Tp) having a benzenethiol skeleton in which one or more hydrogen atoms on the benzene ring are substituted with a mercapto group (-SH). The compound (Tp) is preferably at least one thiol compound selected from the group consisting of 2-aminobenzenethiol, 4-aminobenzenethiol, 3-aminobenzenethiol, and benzenethiol. According to such a flux, changes in the viscosity of the solder paste over time can be further suppressed.