Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, cleaning method, and recording medium

The present disclosure provides a technique capable of reducing an influence of an unintended film formed on a substrate mounting table. The present invention provided a technique, the process gas is supplied to the process chamber while the substrate is on the substrate mounting surface and such th...

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Bibliographische Detailangaben
1. Verfasser:	AKAE, NAONORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present disclosure provides a technique capable of reducing an influence of an unintended film formed on a substrate mounting table. The present invention provided a technique, the process gas is supplied to the process chamber while the substrate is on the substrate mounting surface and such that the cleaning gas and the cleaning assistant gas are supplied to the side surface of the substrate mounting table while the substrate is not on the substrate mounting surface.