Defect verification method, detection method for semiconductor chip carrier and AOI equipment

The present disclosure provides a defect verification method, a detection method for a semiconductor chip carrier and an AOI device, wherein the verification method comprises: scanning the carrier in defect detection to obtain a scanned image of the carrier, and identifying a defect in the scanned image to obtain a defect identification result; segmenting the scanned image to obtain sub-images corresponding to each IC unit to form a sub-image set; traversing each sub-image in the sub-image set, and inputting a sub-image into a pre-trained AI model, wherein the AI model is configured to identify defects with a predefined defect type; if the AI model recognizes that the sub-image is defective, the IC unit corresponding to the sub-image is marked as an abandoned unit, and the next sub-image is traversed. The verification method, detection method and AOI equipment provided by the present disclosure identify and mark key defects in advance through AI algorithm to avoid manual verification of other defects on the s