Epoxy resin composition, metal surface treatment composition, metal laminate production method, adhesion method of metal board

The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide compound, an isocyanate-based compound, a polyetheramine-based comp...

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Bibliographische Detailangaben
Hauptverfasser: OOSATO, TAKUTO, ENDO, HIROTAKA, NAKATSUJI, AKIRA
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide compound, an isocyanate-based compound, a polyetheramine-based compound, a phosphoric acid-modified epoxy resin, a melamine resin and a phenolic resin, and (D) water; a composition for metal surface processing, which contains said epoxy resin composition; a method for producing a metal sheet; and a method for bonding a metal sheet.