Epoxy resin composition, metal surface treatment composition, metal laminate production method, adhesion method of metal board
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide compound, an isocyanate-based compound, a polyetheramine-based comp...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide compound, an isocyanate-based compound, a polyetheramine-based compound, a phosphoric acid-modified epoxy resin, a melamine resin and a phenolic resin, and (D) water; a composition for metal surface processing, which contains said epoxy resin composition; a method for producing a metal sheet; and a method for bonding a metal sheet. |
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