Photosensitive resin composition, resin cured film and image display element
Provided are a photosensitive resin composition and a photosensitive coloring composition which exhibit excellent developability and favorable low-temperature curability, and which can be used to form a cured resin film having sufficient hardness and solvent resistance. This photosensitive resin com...
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| creator | HARA, TSUKASA |
| description | Provided are a photosensitive resin composition and a photosensitive coloring composition which exhibit excellent developability and favorable low-temperature curability, and which can be used to form a cured resin film having sufficient hardness and solvent resistance. This photosensitive resin composition contains a resin (A), a reactive diluent (B), a photopolymerization initiator (C), and a solvent (D). The resin (A) is a product of an addition reaction between: a hydroxyl group-containing (meth)acrylic resin (a-0); a compound (a-4) having an isocyanate group and an ethylenically unsaturated group; and a polybasic acid or anhydride thereof (a-5). Component (a-0) is a copolymer that contains a structural unit derived from a hydroxyl group-containing (meth)acrylate (m-1) and a structural unit derived from a (meth)acrylate (m-2) having one or more groups selected from the group consisting of an active methylene group, an active methine group, an epoxy group, an oxetanyl group, a blocked isocyanate group and |
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Component (a-0) is a copolymer that contains a structural unit derived from a hydroxyl group-containing (meth)acrylate (m-1) and a structural unit derived from a (meth)acrylate (m-2) having one or more groups selected from the group consisting of an active methylene group, an active methine group, an epoxy group, an oxetanyl group, a blocked isocyanate group and</description><language>chi ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; GENERAL PROCESSES OF COMPOUNDING ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240216&DB=EPODOC&CC=TW&NR=202406946A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240216&DB=EPODOC&CC=TW&NR=202406946A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HARA, TSUKASA</creatorcontrib><title>Photosensitive resin composition, resin cured film and image display element</title><description>Provided are a photosensitive resin composition and a photosensitive coloring composition which exhibit excellent developability and favorable low-temperature curability, and which can be used to form a cured resin film having sufficient hardness and solvent resistance. 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| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202406946A |
| source | esp@cenet |
| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY GENERAL PROCESSES OF COMPOUNDING HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | Photosensitive resin composition, resin cured film and image display element |
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