Jet soldering device

A solder removal mechanism 520 is provided to remove solder from a transport claw 510 for transporting a substrate 200 to which solder is supplied. The solder removal mechanism includes an abutment body 530 that can be passed relatively in a recess portion 511 of the transport claw 510 or under the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KAWASHIMA, YASUJI, KURAMOTO, KYOKO, HANZAWA, HENRI, KAGAYA, TOMOTAKE, TAGUCHI, HIROSHI, SHINOHARA, KATSUHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A solder removal mechanism 520 is provided to remove solder from a transport claw 510 for transporting a substrate 200 to which solder is supplied. The solder removal mechanism includes an abutment body 530 that can be passed relatively in a recess portion 511 of the transport claw 510 or under the transport claw 510.