Semiconductor package
A semiconductor package according to an embodiment comprises a substrate; a first protective layer disposed on the substrate and including a through hole; and a second protective layer disposed inside the through hole of the first protective layer and spaced apart from the first protective layer, an...
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| Sprache: | chi ; eng |
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| Zusammenfassung: | A semiconductor package according to an embodiment comprises a substrate; a first protective layer disposed on the substrate and including a through hole; and a second protective layer disposed inside the through hole of the first protective layer and spaced apart from the first protective layer, and wherein an inner surface of the through hole of the first protective layer includes a protrusion surface protruding toward the second protective layer. |
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