Polyamic acid composition

The present application provides a polyamic acid composition capable of simultaneously realizing excellent storage stability, a low dielectric constant, heat resistance, insulation, and mechanical properties under harsh conditions (e.g., high temperature), a polyimide which is a cured product of the...

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Bibliographische Detailangaben
Hauptverfasser:	MOON, GYEONG-MIN, LEE, IK-SANG, RO, GYEONG-HYEON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present application provides a polyamic acid composition capable of simultaneously realizing excellent storage stability, a low dielectric constant, heat resistance, insulation, and mechanical properties under harsh conditions (e.g., high temperature), a polyimide which is a cured product of the composition, a covering material containing the polyimide, and an electronic device including the covering material.