Redistribution layer structure for high-density semiconductor package assembly

Redistribution layer structure for high-density semiconductor package assembly

A redistribution layer (RDL) structure for a semiconductor package assembly is provided. The RDL structure includes a via and a first conductive trace connected to the via. The first conductive trace includes a first segment and a second segment. The first segment is disposed away from the via and e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHANG, WEIN, LIN, YI-JOU, YIP, LAURENE, LAI, TSAI-MING, PENG, I-HSUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A redistribution layer (RDL) structure for a semiconductor package assembly is provided. The RDL structure includes a via and a first conductive trace connected to the via. The first conductive trace includes a first segment and a second segment. The first segment is disposed away from the via and extends along a first direction. The second segment is disposed close to the via and connected to the first segment. The second segment extends along a second direction. A width of the first conductive trace is stepwise increased toward the via.