Electronic devices and methods of manufacturing electronic devices

An electronic device includes a substrate and a first electronic component connected to the substrate, which includes a first electronic component top side. A second electronic is connected to the substrate, laterally spaced apart from the first electronic component, and includes a second electronic component top side. A lid is connected to the substrate, and includes a lid ceiling, and a lid wall extending from the lid ceiling and defining a lid periphery. A dam is connected to the first electronic device top side and the lid ceiling within the lid periphery. A first interface material is over the first electronic component and contained within the dam. A second interface material is over the second electronic component and is connected to the lid ceiling. The dam separates the first interface material from the second interface material. The first interface material has a higher thermal conductivity than the second interface material.