Mounting equipment, inspection equipment, element assembly method and method for manufacturing semiconductor device

To provide a technique for improving the accuracy of inspection of bonded materials. A mounting equipment comprises an imaging device directed at a bonding material having a mirror-reflective surface, an illumination device having a light source installed above the bonding material, and a control un...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KOBASHI, HIDEHARU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	To provide a technique for improving the accuracy of inspection of bonded materials. A mounting equipment comprises an imaging device directed at a bonding material having a mirror-reflective surface, an illumination device having a light source installed above the bonding material, and a control unit configured to inspect the bonding material based on multiple images obtained by the imaging device photographing the bonding material by changing the irradiation position of the light source.