Method for parameter reconstruction of a metrology device and associated metrology device

Disclosed is a method comprising: obtaining measured data relating to at least one measurement by a measurement apparatus configured to irradiate radiation onto each of one or more structures on a substrate; decomposing the measured data using a decomposition method to obtain multiple measured data...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PORTER, CHRISTINA LYNN, COENEN, TEIS JOHAN, HELFENSTEIN, PATRICK PHILIPP, SCHOLZ, SANDY CLAUDIA, VAN RIJSWIJK, LOES FREDERIQUE, MIDDLEBROOKS, SCOTT ANDERSON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS TESTING
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Beschreibung
Zusammenfassung:	Disclosed is a method comprising: obtaining measured data relating to at least one measurement by a measurement apparatus configured to irradiate radiation onto each of one or more structures on a substrate; decomposing the measured data using a decomposition method to obtain multiple measured data components; obtaining simulated data relating to at least one simulation based on the one or more structures; decomposing the simulated data using the decomposition method to obtain multiple simulated data components; matching between at least a portion of the simulated data components and at least a portion of the measured data components; and extracting a feature of the substrate based on the matching of at least a portion of the simulated data components and at least a portion of the measured data components.