Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor devices

A method of metallizing a dielectric substrate with a nickel-boron alloy or cobalt-boron alloy to deposit a thin layer of the alloy that exhibits good conductivity. The process includes an activation step that includes two stages of activation with a noble metal such as palladium. Thereafter, the di...

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Bibliographische Detailangaben
Hauptverfasser:	MEVELLEC, VINCENT, KIM, YEE-SEUL, CAILLARD, LOUIS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method of metallizing a dielectric substrate with a nickel-boron alloy or cobalt-boron alloy to deposit a thin layer of the alloy that exhibits good conductivity. The process includes an activation step that includes two stages of activation with a noble metal such as palladium. Thereafter, the dielectric substrate is metallized with a nickel-boron or cobalt-boron alloy by electroless deposition.