Copper foil for flexible printed substrate, and copper-clad laminate, flexible printed substrate and electronic device using same

To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device using same. A copper foil for a flexible printed substrate, which is a rolled copper f...

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Bibliographische Detailangaben
Hauptverfasser:	BANDO, SHINSUKE, ISHINO, YUJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device using same. A copper foil for a flexible printed substrate, which is a rolled copper foil comprising at least 99.96 mass% Cu, with the remainder being unavoidable impurities, wherein when 300 DEG C heat treatment is carried out for 30 minutes and a measurement field of view of 150 [mu]m * 150 [mu]m of the rolling surface of the rolled copper foil is subjected to EBSD measurement, the standard deviation of the crystal diameter, when a misorientation of 5 DEG or more is considered a crystal boundary, is not more than 3.0 [mu]m.