Tetramethylbiphenol epoxy resin and method for preparing the same, tetramethylbiphenol epoxy resin composition, and cured product

The present invention relates to a tetramethylbiphenol type epoxy resin and a preparation method therefor, and, more specifically, a purification step in which carboxylic acid is used is added to a tetramethylbiphenol type epoxy resin preparation process so that the quantity of metal cations include...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, JI-AE, LEE, GUI-HANG, HONG, SEONG-HO, LEE, EUN-YONG, KANG, SUNG-YEON, JUNG, YONG-SU, HWANG, JAE-SUK, PAEK, MI-JEONG, JUNG, WON-HO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a tetramethylbiphenol type epoxy resin and a preparation method therefor, and, more specifically, a purification step in which carboxylic acid is used is added to a tetramethylbiphenol type epoxy resin preparation process so that the quantity of metal cations included in the tetramethylbiphenol type epoxy resin can be lowered, and thus the purity of the tetramethylbiphenol type epoxy resin can be improved.