Phosphorus-containing (meth)acryloyl compound, method for producing the same, and flame-retardant resin composition comprising phosphorus-containing (meth)acryloyl compound, cured product, and laminate for electronic circuit board

The present invention aims to provide a phosphorus-containing compound that can be used as a reactive phosphorus-based flame retardant, a curable resin composition comprising the phosphorus-containing compound, and a cured product of the curable resin composition. The phosphorus-containing compound...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: WASANO, TSUGUTOSHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention aims to provide a phosphorus-containing compound that can be used as a reactive phosphorus-based flame retardant, a curable resin composition comprising the phosphorus-containing compound, and a cured product of the curable resin composition. The phosphorus-containing compound has excellent solubility in a solvent and demonstrates excellent heat resistance and dielectric properties in a cured product. Provided is a phosphorus-containing (meth)acryloyl compound represented by general formula (1): wherein Y is a substituent represented by general formula (2) or (3) below, and at least one of Ys contains a substituent represented by general formula (3) below.