Electronic component wiring structure, and electronic component connecting method
To reduce transmission loss and improve heat dissipation of a substrate in a high-speed transmission system which is fast and has a high capacity. This electronic component wiring structure is characterized in that a flexible wiring body 4 in which a conductive wiring portion 411 is formed on a flex...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | To reduce transmission loss and improve heat dissipation of a substrate in a high-speed transmission system which is fast and has a high capacity. This electronic component wiring structure is characterized in that a flexible wiring body 4 in which a conductive wiring portion 411 is formed on a flexible insulating base material 40 is interposed between a substrate 2 and an electronic component 3 installed on the substrate 2, the wiring portion 411 and the electronic component 3 being electrically connected to each other. |
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