Patterning method and patterning device

This patterning method includes a soaking step and an etching step. The soaking step involves soaking a material for increasing a selection ratio of an exposure portion and a non-exposure portion on a photoresist film of a substrate having, on a surface thereof, the photoresist film in which the exp...

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Bibliographische Detailangaben
Hauptverfasser:	TSUZUKI, REIKO, YAMADA, KAZUKI, YAMAJI, TOMOHITO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	This patterning method includes a soaking step and an etching step. The soaking step involves soaking a material for increasing a selection ratio of an exposure portion and a non-exposure portion on a photoresist film of a substrate having, on a surface thereof, the photoresist film in which the exposure portion and the non-exposure portion are formed via exposure. The etching step involves dry-etching the photoresist film that has been subjected to the soaking step.