Semiconductor substrate structure and manufacturing method thereof
A semiconductor substrate structure includes a first group of circuit structure and a second group of circuit structure. The first group of circuit structure includes a plurality of first wiring layers and a first bonding layer. The second group of circuit structure includes a plurality of second wi...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A semiconductor substrate structure includes a first group of circuit structure and a second group of circuit structure. The first group of circuit structure includes a plurality of first wiring layers and a first bonding layer. The second group of circuit structure includes a plurality of second wiring layers and a second bonding layer. The second group of circuit structure is disposed on the first group of circuit structure and is electrically connected to the first group of circuit structure. The first bonding layer is bonded to the second bonding layer to form a multilayer redistribution structure. A manufacturing method of the semiconductor substrate structure is also provided. |
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