Photosensitive resin composition, cured product, multilayer body, method for producing cured product, method for producing multilayer body, method for producing semiconductor device, and semiconductor device
The present invention provides: a photosensitive resin composition which contains a polyimide precursor that contains a repeating unit represented by formula (1), a polymerizable compound and a photopolymerization initiator; a cured product; a multilayer body; a method for producing a cured product;...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention provides: a photosensitive resin composition which contains a polyimide precursor that contains a repeating unit represented by formula (1), a polymerizable compound and a photopolymerization initiator; a cured product; a multilayer body; a method for producing a cured product; a method for producing a multilayer body; a method for producing a semiconductor device; and a semiconductor device. In the formula, Z1 represents an organic group which comprises two or more ether groups and a benzene ring structure; Y1 represents an organic group; each of A1 and A2 independently represents an oxygen atom or -NRZ-; RZ represents a hydrogen atom or an organic group; each of R1 and R2 independently represents a hydrogen atom or an organic group; and at least one of R1 and R2 represents an organic group that has an ethylenically unsaturated bond. |
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