UV LED curable hotmelt pressure sensitive adhesive composition
The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention.
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SCHNEIDER, ANJA ROSCHKOWSKI, THOMAS ARNOLD, MORITZ TADEN, ANDREAS |
| description | The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202348653A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202348653A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202348653A3</originalsourceid><addsrcrecordid>eNrjZLALDVPwcXVRSC4tSkzKSVXIyC_JTc0pUSgoSi0uLi1KVShOzSvOLMksS1VITMlILQYxkvNzC_JBgvl5PAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPiTcyMDI2MTCzNTY0ZgYNQBRWjDm</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>UV LED curable hotmelt pressure sensitive adhesive composition</title><source>esp@cenet</source><creator>SCHNEIDER, ANJA ; ROSCHKOWSKI, THOMAS ; ARNOLD, MORITZ ; TADEN, ANDREAS</creator><creatorcontrib>SCHNEIDER, ANJA ; ROSCHKOWSKI, THOMAS ; ARNOLD, MORITZ ; TADEN, ANDREAS</creatorcontrib><description>The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention.</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231216&DB=EPODOC&CC=TW&NR=202348653A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231216&DB=EPODOC&CC=TW&NR=202348653A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHNEIDER, ANJA</creatorcontrib><creatorcontrib>ROSCHKOWSKI, THOMAS</creatorcontrib><creatorcontrib>ARNOLD, MORITZ</creatorcontrib><creatorcontrib>TADEN, ANDREAS</creatorcontrib><title>UV LED curable hotmelt pressure sensitive adhesive composition</title><description>The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALDVPwcXVRSC4tSkzKSVXIyC_JTc0pUSgoSi0uLi1KVShOzSvOLMksS1VITMlILQYxkvNzC_JBgvl5PAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPiTcyMDI2MTCzNTY0ZgYNQBRWjDm</recordid><startdate>20231216</startdate><enddate>20231216</enddate><creator>SCHNEIDER, ANJA</creator><creator>ROSCHKOWSKI, THOMAS</creator><creator>ARNOLD, MORITZ</creator><creator>TADEN, ANDREAS</creator><scope>EVB</scope></search><sort><creationdate>20231216</creationdate><title>UV LED curable hotmelt pressure sensitive adhesive composition</title><author>SCHNEIDER, ANJA ; ROSCHKOWSKI, THOMAS ; ARNOLD, MORITZ ; TADEN, ANDREAS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202348653A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHNEIDER, ANJA</creatorcontrib><creatorcontrib>ROSCHKOWSKI, THOMAS</creatorcontrib><creatorcontrib>ARNOLD, MORITZ</creatorcontrib><creatorcontrib>TADEN, ANDREAS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHNEIDER, ANJA</au><au>ROSCHKOWSKI, THOMAS</au><au>ARNOLD, MORITZ</au><au>TADEN, ANDREAS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>UV LED curable hotmelt pressure sensitive adhesive composition</title><date>2023-12-16</date><risdate>2023</risdate><abstract>The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202348653A |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | UV LED curable hotmelt pressure sensitive adhesive composition |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T11%3A40%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SCHNEIDER,%20ANJA&rft.date=2023-12-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202348653A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |