UV LED curable hotmelt pressure sensitive adhesive composition
The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention.
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention. |
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