High frequency circuit structure and manufacturing method thereof

A high frequency circuit structure includes a substrate, a conductive body and at least one insulative body. The conductive body extends along a particular direction. The insulative body is sandwiched between the substrate and the conductive body. The insulative body extends along the direction ment...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAI, HANUNG, LIU, SHU-JIANG, YU, ZHI-JAIN, LI, WEN-JEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!