High frequency circuit structure and manufacturing method thereof
A high frequency circuit structure includes a substrate, a conductive body and at least one insulative body. The conductive body extends along a particular direction. The insulative body is sandwiched between the substrate and the conductive body. The insulative body extends along the direction ment...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A high frequency circuit structure includes a substrate, a conductive body and at least one insulative body. The conductive body extends along a particular direction. The insulative body is sandwiched between the substrate and the conductive body. The insulative body extends along the direction mentioned above. |
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