Circuit board assembly and method of manufacturing thereof
A method of manufacturing a circuit board assembly includes forming a shielding can, and disposing a thermal-conductive gel and an electronic component in the shielding can, such that the shielding can, the thermal-conductive gel and the electronic component are collectively formed a package module....
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| creator | ZHU, SEAN XIAN-JIANG LI, WEI-XIANG |
| description | A method of manufacturing a circuit board assembly includes forming a shielding can, and disposing a thermal-conductive gel and an electronic component in the shielding can, such that the shielding can, the thermal-conductive gel and the electronic component are collectively formed a package module. The method further includes mounting the package module on a pad of a first circuit substrate, and electrically connecting the electronic component and the pad. The method further includes disposing a second circuit substrate on the first circuit substrate after mounting the package module on the pad of the first circuit substrate. The second circuit substrate laterally surrounds the package module. A circuit board assembly is provided. |
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The method further includes mounting the package module on a pad of a first circuit substrate, and electrically connecting the electronic component and the pad. The method further includes disposing a second circuit substrate on the first circuit substrate after mounting the package module on the pad of the first circuit substrate. The second circuit substrate laterally surrounds the package module. 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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Circuit board assembly and method of manufacturing thereof |
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