Circuit board assembly and method of manufacturing thereof

A method of manufacturing a circuit board assembly includes forming a shielding can, and disposing a thermal-conductive gel and an electronic component in the shielding can, such that the shielding can, the thermal-conductive gel and the electronic component are collectively formed a package module. The method further includes mounting the package module on a pad of a first circuit substrate, and electrically connecting the electronic component and the pad. The method further includes disposing a second circuit substrate on the first circuit substrate after mounting the package module on the pad of the first circuit substrate. The second circuit substrate laterally surrounds the package module. A circuit board assembly is provided.