Thermoelectric conversion module
Provided is a thin thermoelectric conversion module that does not have a support substrate and a solder layer, wherein electrodes M1 or M2 that are shared between adjacent p-type thermoelectric conversion material chips 3p and n-type thermoelectric conversion material chips 3n are arranged (wired) d...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | Provided is a thin thermoelectric conversion module that does not have a support substrate and a solder layer, wherein electrodes M1 or M2 that are shared between adjacent p-type thermoelectric conversion material chips 3p and n-type thermoelectric conversion material chips 3n are arranged (wired) directly onto upper/lower surfaces of the p-type thermoelectric conversion material chips 3p and n-type thermoelectric conversion material chips 3n so as to straddle opposite insulation layers L1, L2 that span gaps between the p-type thermoelectric conversion material chips 3p and n-type thermoelectric conversion material chips 3n. |
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