Methods and apparatus for post exposure processing

Embodiments described herein relate to methods and apparatus for post exposure processing. More specifically, embodiments described herein relate to field-guided post exposure bake (iFGPEB) chambers and processes. In one embodiment, a substrate is transferred into a post exposure process chamber and...

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Bibliographische Detailangaben
Hauptverfasser:	TSO, ALAN, LIANG, QIWEI, HUANG, LANCELOT, PISHARODY, GAUTAM
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Embodiments described herein relate to methods and apparatus for post exposure processing. More specifically, embodiments described herein relate to field-guided post exposure bake (iFGPEB) chambers and processes. In one embodiment, a substrate is transferred into a post exposure process chamber and then raised to a pre-processing position by a plurality of lift pins. A substrate support is then raised to engage with the substrate and vacuum chuck the substrate thereon prior to iFGPEB processing.