Conductive film, connection structure and manufacturing method for the same without reducing the initial conduction characteristics even if the average particle diameter of conductive particles is less than 3 [mu]m in order to be suitable for high-density packaging
The present invention is a connection structure in which a first electronic component and a second electronic component are connected together in a state of including alignment deviation via an insulating adhesive and conductive particles disposed between the electrodes of the first electronic compo...
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| Format: | Patent |
| Sprache: | chi ; eng |
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