Conductive film, connection structure and manufacturing method for the same without reducing the initial conduction characteristics even if the average particle diameter of conductive particles is less than 3 [mu]m in order to be suitable for high-density packaging

The present invention is a connection structure in which a first electronic component and a second electronic component are connected together in a state of including alignment deviation via an insulating adhesive and conductive particles disposed between the electrodes of the first electronic component and the electrode of the second electronic component. Even if the above-mentioned connection structure incudes the conductive particles with an average particle diameter of less than 3 [mu]m used in order to be suitable for high-density packaging, the initial conduction characteristics will not be reduced and the occurrence of short circuits is suppressed. In the connection structure of the present invention, the electrode of the first electronic component and the electrode of the second electronic component are aligned so as to face each other, and conductive particles and insulating adhesives are arranged between the aligned electrodes to connect together the first electronic component and the second electro