Curable resin composition

To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under high-temperature and high-humidity conditions, and yielding a cured coati...

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Bibliographische Detailangaben
Hauptverfasser:	TAKASHIMA, SHUHEI, ODAGIRI, YUTO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under high-temperature and high-humidity conditions, and yielding a cured coating film having high hardness after curing. A curable resin composition containing (A) an epoxy compound, (B) an oxetane compound, (C) a photoacid generator, and (D) a black colorant, wherein the (A) epoxy compound contains (a) an alicyclic epoxy compound having an ester bond in each molecule and (b) an alicyclic epoxy compound not having an ester bond in each molecule in a mass ratio within a numerical range of 5:100-30:100.