Substrate for high-frequency device comprising a transparent glass substrate and a transparent resin substrate that are adhered to each other through an optically transparent adhesive
The present invention provides a substrate for a high-frequency device that meets the requirements of having low dielectric tangent, being adhesive, and being transparent. The substrate for a high-frequency device has a transparent glass substrate 16 and a transparent resin substrate 20. The transpa...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention provides a substrate for a high-frequency device that meets the requirements of having low dielectric tangent, being adhesive, and being transparent. The substrate for a high-frequency device has a transparent glass substrate 16 and a transparent resin substrate 20. The transparent resin substrate 20 is adhered to the glass substrate 16 through an optically transparent adhesive 18. For the resin substrate 20, its dielectric tangent in the dielectric tangent measurement test is 0.01 or less, its peeling force in the peeling test is 3.0 N/cm or more, and its outgas amount in the outgassing test is 5.0 [mu]g/g or less. |
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