Laser processing method for printed substrate and laser processing machine for printed substrate which especially has a damping disposed between the lens and a workpiece for absorbing the energy of the beam

Provided is a laser processing method for printed substrates and a laser processing machine for printed substrates, which are capable of utilizing 100% of the capacity of a laser oscillator and uniformly supplying laser energy to a processing section, thereby improving processing quality and process...

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Bibliographische Detailangaben
Hauptverfasser:	HATA, IZUMI, SATO, TATSUO, KITA, YASUHIKO, TATEISHI, HIDENORI, ISHII, KAUHISA, ARAI, KUNIO, KANAYA, YASUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a laser processing method for printed substrates and a laser processing machine for printed substrates, which are capable of utilizing 100% of the capacity of a laser oscillator and uniformly supplying laser energy to a processing section, thereby improving processing quality and processing efficiency. The laser processing method for printed substrates utilizes a laser oscillator with output controlled by a high-frequency pulse RF to irradiate a beam of light to a workpiece for processing. Wherein, between the start of the processing and the end of the processing, if the high-frequency pulse RF is not activated within a predetermined period of time, the high-frequency pulse RF is activated repeatedly for a predetermined period of time, and the output beam is directed into a damping for absorbing the energy of the beam. The laser processing machine includes a laser oscillator and an optical axis positioning device.