Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the sec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN, JIE, CHIU, YUAN-SHENG, LIN, TSUNG-SHU, YEH, YU-KUEI, HSU, CHOU-JUI, TSAI, SHENG-HAN, LIN, CHIN-YI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the second pad.