System and method for bonding die in which the system for bonding die includes a die transfer device, a die connecting device, an integrated camera, and a control part

The present invention relates to a system and a method for bonding die by attaching individual dies on a wafer to a substrate. The system for bonding die includes: a die transfer device, which transfers a die on a cutting tape to a die platform by vacuum suction; a die connecting device, which performs vacuum suction on the die transported to the die platform for further transfer towards the substrate to connect the die to the substrate in order to bond the die to the substrate; an integrated camera, which photographs a transfer chuck of the die transfer device and also photographs a connection chuck of the die connecting device; and a control part, which positions the transfer chuck on a shooting axis of the integrated camera, and applies control signals to the die transfer device and the die connecting device respectively, in order to position the connection chuck on the shooting axis of the integrated camera.