Resin composition, cured product, multilayer body, method for producing cured product, method for producing multilayer body, method for producing semiconductor device, and semiconductor device

The present invention provides a resin composition which contains a resin and a metallocene compound, wherein: the metallocene compound comprises a metal atom, an optionally substituted cyclopentadienyl ligand, and an aromatic ring that is directly bonded to the metal atom; the aromatic ring has, as...

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Bibliographische Detailangaben
Hauptverfasser: OOTA, KAZUYA, ASAKAWA, DAISUKE, DAIKUHARA, KENJI, AOSHIMA, TOSHIHIDE
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention provides a resin composition which contains a resin and a metallocene compound, wherein: the metallocene compound comprises a metal atom, an optionally substituted cyclopentadienyl ligand, and an aromatic ring that is directly bonded to the metal atom; the aromatic ring has, as a substituent which is directly bonded to the aromatic ring, an electron-withdrawing group that is different from a halogen atom; and the molar absorption coefficient of the metallocene compound at 500 nm is 330 mol-1.L.cm-1 or less. The present invention also provides: a cured product; a multilayer body which comprises a cured product; a method for producing a cured product; a method for producing a multilayer body; a method for producing a semiconductor device, the method comprising a method for producing a multilayer body; and a semiconductor device which comprises a cured product or a multilayer body.