Slicing apparatus and slicing method

The present invention provides a slicing apparatus and a slicing method. The slicing apparatus includes an adjustment platform and a slicing mechanism. The adjustment platform defines an accommodating space corresponding in position to a carrying surface thereof. The slicing mechanism corresponds in position to and is relatively rotatable to the adjustment platform. The slicing mechanism includes at least one winding seat and a slicing wire. The at least one winding seat includes a base being movable to the adjustment platform and a first guiding roller that is assembled to the base. The slicing wire is arranged along the first guiding roller of the at least one winding seat so as to form a first slicing segment. The slicing mechanism and the adjustment platform are configured to be movable relative to each other along a direction non-perpendicular to the carrying surface, so that the first slicing segment is allowed to pass through the accommodating space.