Bonded structure

A bonded structure in which an electronic component and a wiring substrate are bonded to each other, the bonded structure comprising, in order from the electronic component side, a first metal layer comprising a metal that forms an inter-metallic compound with Sn, an inter-metallic compound layer co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HOTTA, YUHEI, WATANABE, TAKASHI, MITOSE, TOMOHISA, IKEBE, KIRYU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A bonded structure in which an electronic component and a wiring substrate are bonded to each other, the bonded structure comprising, in order from the electronic component side, a first metal layer comprising a metal that forms an inter-metallic compound with Sn, an inter-metallic compound layer composed of an inter-metallic compound comprising Sn, and a second metal layer comprising Sn, wherein the thickness of the second metal layer is less than or equal to 50% of a total of the thicknesses of the first metal layer, the inter-metallic compound layer, and the second metal layer.